Model/Brand/Package
Category/Description
Inventory
Price
Data
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Category: Classification of electronic componentsDescription: Sil-Pad400,9Mil,Non-Adhesive/7403-09FR-1012225 -
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Category: Classification of electronic componentsDescription: Sil Pad 400, .009 thick, no adhesive,7112 -
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Category: Classification of electronic componentsDescription: Sil Pad 400, .009" thick, no adhesive8000 -
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Category: Classification of electronic componentsDescription: Thermal Interface Products SILPAD 2000H PERF W/ADH 12X1241951+$3019.581410+$2992.130725+$2978.405350+$2964.6799100+$2950.9546150+$2937.2292250+$2923.5038500+$2909.7784 -
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Category: Classification of electronic componentsDescription: Bergquist Sil-Pad 2000 Bergquist Sil-Pad 2000 It is a high-performance, thermally conductive insulator suitable for demanding military/aviation and other commercial applications. Sil Pad 2000 is a grease free, highly adaptable material that can meet or even exceed the thermal and electrical requirements of high reliability electronic packaging applications. High performance insulator with good thermal conductivity and high reliability, suitable for demanding military and aerospace applications. Compliant with military standards, boron nitride reinforced silicone synthetic rubber Sil pad 2000 is an insulation material designed to maximize heat dissipation and dielectric performance781510+$10.5348100+$10.0081500+$9.65691000+$9.63932000+$9.56915000+$9.48137500+$9.411110000+$9.3760 -
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Category: Classification of electronic componentsDescription: SilPad2000, 15Mil, adhesive, 12x1283701+$3298.350010+$3268.365025+$3253.372550+$3238.3800100+$3223.3875150+$3208.3950250+$3193.4025500+$3178.4100 -
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Category: Classification of electronic componentsDescription: Sil-Pad K4 TO220 0.15mm adhesive 0.9W/mK54775+$5.722725+$5.298850+$5.0020100+$4.8749500+$4.79012500+$4.68415000+$4.641710000+$4.5781 -
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Category: Classification of electronic componentsDescription: Thermal Interface Products POLYPAD 1000 .009" 12X12"1139 -
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Category: Classification of electronic componentsDescription: Sil Pad 1750, UL94 1950, IEC 950, .012" thick, Adhesive, one side8113 -
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Category: Classification of electronic componentsDescription: SilPad 2000, 10Mil, non adhesive7401 -
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Category: Classification of electronic componentsDescription: 50CC MANUAL GUN 1:1 RATIO71661+$491.209910+$478.395750+$468.5715100+$465.1544200+$462.5915500+$459.17441000+$457.03872000+$454.9030 -
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Category: Classification of electronic componentsDescription: Thermal Interface Products RH-5 .015" No ADH .725 X .771"617410+$6.9744100+$6.6257500+$6.39321000+$6.38162000+$6.33515000+$6.27707500+$6.230510000+$6.2072 -
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Category: Classification of electronic componentsDescription: GAP PAD, 0.06", 100X100MM SHEET; Case Style: Pad; Material: Gap Pad VO; Type: Thermal Pad; Length: 100mm; Width, Exte...29521+$101.266710+$96.8638100+$96.0713250+$95.4549500+$94.48621000+$94.04592500+$93.42955000+$92.9012 -
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Category: Classification of electronic componentsDescription: Gap Pad® VO Ultimate Gap Pad® VO Ultimate is a robust, highly compliant product that is ideal for both small and large gap designs. The fibreglass carrier on one side of the material allows ease of rework, excellent handling characteristics and puncture resistance. Additionally the fibreglass carrier has a slight inherent tack, minimizing any shifting during assembly. The conformable and elastic nature of Gap Pad® VO Ultimate allows excellent interfacing and wet-out characteristics, even to surfaces with a high degree of roughness or uneven topography. The construction of Gap Pad® VO Ultimate; one side has high inherent tack, while the other side has minimal tack. This combination is useful for manual and automated processes. Typical applications include various IC packages, thermally enhanced BGA packages, between heat-generating semiconductors and a heat sink, computers and peripherals, telecommunications, power conversion, automotive and LED lighting packages. Thermal conductivity:65291+$360.314610+$350.915050+$343.7087100+$341.2022200+$339.3223500+$336.81581000+$335.24922000+$333.6826 -
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Category: Classification of electronic componentsDescription: Hi-Flow 650P Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad ### Thermal insulation (heat sink)91655+$23.784950+$22.7685200+$22.1993500+$22.05701000+$21.91472500+$21.75205000+$21.65047500+$21.5487 -
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Category: Classification of electronic componentsDescription: Hi-Flow 650P Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad ### Thermal insulation (heat sink)37525+$16.253650+$15.5590200+$15.1701500+$15.07281000+$14.97562500+$14.86445000+$14.79507500+$14.7255 -
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Category: Classification of electronic componentsDescription: Gap Pad® 2200SF Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework. Typical applications include digital disk drives, proximity near electrical contacts (e.g. DC brush motors, connectors, relays) and fibre optics modules. Thermal conductivity: 2.0 W/m-K Silicone-free formulation Medium compliance with easy handling Electrically isolating ### Thermal insulation (heat sink)56331+$646.246610+$623.571350+$620.7369100+$617.9025150+$613.3674250+$609.3992500+$605.43101000+$600.8960
